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IC · dip-8
The MAX706EPA+ from Maxim Integrated is an IC supplied in a DIP-8 package. Its through-hole package format makes the part suitable for compatible DIP footprints, prototyping layouts, and designs where a removable socket may be used. Confirm the MAX706EPA+ package and application requirements against your design documentation before selection.
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The MAX706EPA+ from Maxim Integrated is an IC supplied in a DIP-8 package. Its through-hole package format makes the part suitable for compatible DIP footprints, prototyping layouts, and designs where a removable socket may be used. Confirm the MAX706EPA+ package and application requirements against your design documentation before selection.
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