Radxa CM-Q64 is a compact System-on-Module for edge AI, machine vision, robotics and connected embedded products. Built around the Qualcomm Dragonwing QCS6490 platform, it combines an eight-core Kryo 670 CPU, Adreno 643 graphics and a Hexagon 770 AI accelerator rated at up to 12 TOPS of dense compute.

Key specifications • Qualcomm QCS6490; CPU clock up to 2.7 GHz • LPDDR5 memory options up to 16 GB • Optional eMMC 5.1 or UFS 3.1 storage; microSD and PCIe Gen 3 ×2 expansion support • DisplayPort, HDMI and MIPI DSI display interfaces; MIPI CSI camera interfaces • USB, UART, I2C, SPI, PWM and GPIO signals through three 100-pin board-to-board connectors • Optional 1 GbE or 2.5 GbE Ethernet hardware • Optional FCU760K wireless module with Wi-Fi 6 and Bluetooth 5.4 • 55 × 40 mm module footprint; 5 V DC input

Configuration and integration CM-Q64 is a compute module, not a complete standalone computer. External connectors and peripherals require a compatible carrier-board design. RAM capacity, onboard storage, Ethernet and wireless hardware depend on the selected configuration. Carrier boards, cameras, displays, antennas and other accessories are not included unless specifically listed in your quotation.

The official photos show reference hardware and may include optional components. Consult the linked Radxa CM-Q64 Product Brief (Draft 0.9) for interface and integration information. Send HONGTE your required RAM, storage, connectivity configuration and quantity for pricing, availability and lead-time confirmation.